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发明授权
CN100585760C 电子零件的安装方法及电子零件的安装构造 失效 - 权利终止

电子零件的安装方法及电子零件的安装构造
摘要：
一种电子零件的安装方法，具备相互间的空隙尺寸为500μm以下的一对端子电极的电子零件通过将一对端子电极经由导电性粘接剂分别粘接在电路基板的一对焊盘上而被安装到电路基板上，其特征在于，以一对导电性粘接剂间的间隙尺寸比一对焊盘间的间隙尺寸大100μm以上的形式，在一对焊盘上分别印刷导电性粘接剂，之后，用导电性粘接剂将电子零件粘接在电路基板上地进行安装。
摘要（英）：

An electronic component mounting method for mounting an electronic component, which includes a pair of terminal electrodes with an interval dimension therebetween being 500 mu m or less, on a circuit board by bonding the pair of terminal electrodes to a pair of lands of the circuit board via conductive adhesives respectively, characterized in that: the pair of conductive adhesives are printed on the pair of lands respectively with a gap dimension between the pair of conductive adhesives being larger than a gap dimension between the pair of lands by 100 mu m or more; and thereafter, the electronic component is mounted on the circuit board while being bonded to the circuit board via the conductive adhesives.

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