A reciprocal design symmetry allows stacked wafers (120 and 122) or die (154) on wafer to use identical designs or designs that vary only by a few layers (e.g. metal interconnect layers). Flipping orrotating one die or wafer allows the stacked die to have a reciprocal orientation with respect to each other which may be used to decrease the interconnect (270-279, 89-80) required between the vertically stacked die and or wafers. Flipping and/or rotating may also be used to improve heat dissipation when wafer and/or die are stacked. The stacked wafers or die may then be packaged.