There is provided a thermoelectric conversion module comprising a first insulated substrate, a plurality of columnar p-type and n-type semiconductor thermoelectric transducers alternately arranged on the first insulated substrate, a second insulated substrate arranged so as to face the first insulation with interposition of the semiconductor thermoelectric transducers, first electrodes arranged between the first insulated substrate and the respective semiconductor thermoelectric transducers, and second electrodes arranged between the second insulated substrate and the respective semiconductor thermoelectric transducers, the first and second electrodes electrically connecting the p-type and n-type semiconductor thermoelectric transducers in series, and a glass film coated on the exposed surface of each first electrode at the first insulated substrate side and on a part of the exposed surfaces of the p-type and n-type semiconductor thermoelectric transducers directed from the first electrode to the second electrode.