An active energy ray-curable resin composition is handleable when it is formed into an uncured film. The resin composition cures quickly, is formable, and can be used to make a hard coat layer with a high hardness. Specifically, the active energy ray-curable resin composition of the present invention contains a vinyl polymer having alkoxysilyl groups in its side chain, along with a photoacid generator. In its uncured state, the active energy ray-curable resin composition has a glass transition temperature of 15 DEG C to 100 DEG C 90 mass % or more of the Si-containing compound or Si-containing compound unit present in the active energy ray-curable resin composition is represented by the following structural formula 1: (R<1>)nSi(OR<2>)4-n (Structural formula 1) wherein R<1> is a structural unit of the backbone of the vinyl polymer of the component (a), a residue bound to the backbone, a polymerizable group that can serve as the structural unit or the residues or a substituted or unsubstituted alkyl or aryl group; R<2> is an alkyl group having 1 to 5 carbon atoms; and n is an integer of 1 to 3.