When implementing probe mark check using a probe card equipped with film probe, a vision check system (51ú®check the appearance of the main surface of the object that is wafer in vision, according to the sort order of the corresponding chip in the surface of the wafer, to collect the check result such as dust particulate adhering to the main surface of the wafer or the shape singularity of the bump electrodes on the surface of the wafer, as wafer image data. Transmitting the wafer image data to a probe check system (53) by a server (52), then based on the wafer image data to omit probe mark check for the chip which does not pass through vision check, and to implement probe mark check to the other chips passing through vision check.