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发明授权
CN101189928B 支承电子部件的方法和具有用于电子部件的弹性支承的电子装置 失效 - 权利终止

支承电子部件的方法和具有用于电子部件的弹性支承的电子装置
摘要：
为电子装置中的电子部件(17)提供支承的一种方法，所述电子装置包含有PCB(印刷电路板)(14)和至少覆盖一部分PCB(14)的结构元件(15)。所述方法包括步骤：把电子部件(17)安装在PCB(14)上，和把弹性可压缩及吸震的材料(18)实施于结构元件(15)上适合于覆盖部件(17)的区域(22)处，；和以这种方式组装PCB(14)与结构元件(15)：使弹性可压缩及吸震的材料在电子部件(17)上朝向PCB(14)施加压力。还公开了在所述结构元件与PCB之间含有弹性可压缩及吸震的材料的一种电子装置。
摘要（英）：

A method of providing support for an electronic component (17) in an electronic device comprising a PCB (printed circuit board) (14) and a structural element (15) covering at least a part of the PCB (14). The method comprises the steps of mounting the electronic component (17) on the PCB (14), applying an elastically compressible and shock-absorbing material (18) to the structural element (15) atan area (22) thereof that is adapted to cover the component (17), and assembling the PCB (14) and the structural element (15) in such manner that the elastically compressible and shock-absorbing material (18) exerts a pressure on the electronic component (17) towards the PCB (14). An electronic device comprising an elastically compressible and shock-absorbing material between the structural element and the PCB is also disclosed.

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