A heat dissipating device comprises a base, a plurality of heat dissipating fins and at least a heat tube connecting the base and the heat dissipating fins, among which, the base comprises a first heat conducting placode and a second heat conducting placode, the material adopted by the first placode has a higher heat conductivity than the one adopted by the second placode, and the heat tube is connected with the first placode. The base formed by combining the first placode and the second placode in the heat dissipating device utilizes materials with high heat conductivity at high temperature zones while materials with low cost and relatively less weight are used at the neighboring zones, which can ensure that the base has better heat conducting performance without enhancing the cost and weight to a great scale, and further improve the performance of the whole heat dissipating device.