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发明公开
CN101211906A 封装芯片结构 失效 - 权利终止 转让

封装芯片结构
摘要：
本发明涉及一种封装芯片结构，包括闪存芯片、控制器芯片以及承载闪存芯片、控制器芯片的印刷电路板，所述闪存芯片上的每一个引脚都有一个可导电凸块，所述印刷电路板上设置相应的焊点，还包括导电线，所述的闪存芯片的有可导电凸块的面向下倒压组装在印刷电路板上，所述的可导电凸块和印刷电路板上的焊点形成导电性的固定连接，控制器芯片重叠放置于所述的闪存芯片上并固定，所述导电线连接控制器芯片的引脚与印刷电路板上的焊点并固定。利用本发明的技术方案可以使得在使用闪存芯片的大容量存储，使得电子设备的体积明显的被压缩和降低封装成本。
摘要（英）：

The invention relates to an encapsulation structure of chips, which comprises a flash chip, a controller chip and printed circuit boards for bearing the flash chip and the controller chip; each pin on the flash chip is provide with a conductive bump; corresponding welding spot is arranged on the printing circuit plate; and also comprises conductive wires; the surface with conductive bump of the flash chip is pressed and assembled downward the printing circuit plate; a conductive fixed connection is formed by the welding spot in the conductive bump and the printing circuit plate; the controller chip overlapping arranged and fixed on the flash chip; the pin of the controller chip is connect and fixed with the welding spot of the printing circuit plate by conductive wires. The technical proposal of the invention can realize a large storage of the flash chip, an obvious compression to the volume of the electrically equipments and reduction of the encapsulation cost.

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