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发明授权
CN101211906B 封装芯片结构 失效 - 权利终止 转让

封装芯片结构
摘要：
本发明涉及一种封装芯片结构，包括闪存芯片、控制器芯片以及承载闪存芯片、控制器芯片的印刷电路板，所述闪存芯片上的每一个引脚都有一个可导电凸块，所述印刷电路板上设置相应的焊点，还包括导电线，所述的闪存芯片形成芯片阵列，所述芯片阵列的闪存芯片的有可导电凸块的面向下倒压组装在印刷电路板上，所述的可导电凸块和印刷电路板上的焊点形成导电性的固定连接，控制器芯片重叠放置于所述芯片阵列的闪存芯片上并固定，所述导电线连接控制器芯片的引脚与印刷电路板上的焊点并固定。利用本发明的技术方案可以使得在使用闪存芯片的大容量存储，使得电子设备的体积明显的被压缩和降低封装成本。
摘要（英）：

The present invention relates to an encapsulation structure of chips, which comprises a flash chip, a controller chip and printed circuit boards for bearing the flash chip and the controller chip; each pin on the flash chip is provide with a conductive bump; corresponding welding spot is arranged on the printing circuit plate; and also comprises conductive wires; a chip array is formed by the flash chip; the surface with conductive bump of the flash chip is pressed and assembled downward the printing circuit plate; a conductive fixed connection is formed by the welding spot in the conductive bump and the printing circuit plate; the controller chip overlapping arranged and fixed on the flash chip of the chip array; the pin of the controller chip is connect and fixed with the welding spot of the printing circuit plate by conductive wires. The technical proposal of the invention can realize a large storage of the flash chip, an obvious compression to the volume of the electrically equipments and reduction of the encapsulation cost.

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