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发明授权
CN101222010B 光电元件封装结构及其封装方法 失效 - 权利终止

光电元件封装结构及其封装方法
摘要：
本发明提供一种光电元件封装结构，包括：一基板；一反射器，形成于该基板的一第一面上；一盖板，贴合于该反射器上，以形成一封闭空间；多个微透镜，形成于该盖板的一第一面上；一荧光膜，形成于该盖板的一第二面上并位于该封闭空间内；一导热膜，形成于该基板的一第二面上；一电极，形成于该基板的侧壁与未覆盖该导热膜的该第二面上；以及一光电元件，形成于该基板的该第一面上并位于该封闭空间内。本发明还提供一种光电元件的封装方法。
摘要（英）：

An optoelectronic device package. The optoelectronic device package includes a substrate, a reflector formed on a first plane of the substrate, a cover bonded to the reflector to form a closed space,a plurality of microlenses formed on a first plane of the cover, a phosphor film formed on a second plane of the cover within the closed space, a thermal-conductive film formed on a second plane of the substrate, an electrode formed on the sidewall and the second plane of the substrate uncovered by the thermal-conductive film, and an optoelectronic device formed on the first plane of the substratewithin the closed space. The invention also provides a method of packaging the optoelectronic device.

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