The invention relates to a heat-sink and butt method of a transistor end face in a laser diode-pumping solid laser, characterized in that a semicircle hollow cavity with the center of the circle downward is arranged at the lower end of an upper bracket (5) and a semicircle hollow cavity with the center of the circle upward is arranged at the upper end of a lower bracket (6), one bracket of the lower bracket (6) is provided with a backrest (9) which is in axially vertical integration with a semicircle hollow cavity, the semicircle hollow cavities of the upper bracket (5) and the lower bracket (6) form a round hollow cavity, a diamond sheet (1) axially extends in the round hollow cavity, an upper clamping piece (3) and a lower clamping piece (4) form a small round cavity which can accommodate a cylindrical YAG transistor rod (2), one end face of the cylindrical YAG transistor rod (2) is combined with the rear end surface of the diamond flake (1) along the axial direction of the small round cavity so as to compact the end face of the transistor with the transistor rod together reliably without damaging the end face of the transistor and the transistor rod, which not only ensures that the elements are not damaged, but also realizes that a contacting resistance is to be as small as possible.