The invention discloses a joint method suitable for jointing a display panel and a plurality of chips. A plurality of first join pads are arranged in a first peripheral circuit territory of the display panel, and a plurality of second joint pads are arranged in a second periphery circuit territory of the display panel. The joint method comprises the following steps: first, a first anisotropic conductive adhesive is attached to the first joint pad; a plurality of first chips are arranged on the first anisotropic adhesive; the first pressing manufacture process is carried out so that the first chips are electrically connected with the first joint pads; a second anisotropic conductive adhesive is attached to the second joint pads; and a plurality of second chips and at least one flexible circuit board are arranged on the second anisotropic conductive adhesive; then the second pressing manufacture process is carried out, so that the second chips and one end of the flexible circuit board are electrically connected with the second joint pads through the second anisotropic conductive adhesive. The joint method provided by the invention makes use of few steps to joint the plurality of chips and the display panel, thereby reducing manufacturing cost of a display device.