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发明授权
CN101323769B 晶片接合用树脂胶 失效 - 权利终止

晶片接合用树脂胶
摘要：
公开了一种晶片接合用树脂胶，该树脂胶含有：具有羧酸端基的丁二烯的均聚物或共聚物(A)、热固性树脂(B)、填料(C)以及印刷用溶剂(D)，其干燥固化后的弹性模数为1-100MPa(25℃)。优选的是，其固体成分为40-90重量％，触变指数为1.5-8.0，粘度(25℃)为5-1000Pa·s。该半导体器件的制造方法是，使用上述树脂胶，按下列步骤制造半导体器件：(1)在衬底上涂布规定量的树脂胶，(2)将上述树脂胶干燥并使树脂B阶化，(3)在B阶化后的树脂胶上搭载半导体晶片，(4)将树脂进行后固化。
摘要（英）：

Disclosed is a resin paste for die bonding comprising a carboxylic acid-terminated butadiene homopolymer or copolymer (A), a thermosetting resin (B), a filler (C), and a solvent (D) for printing. This resin paste has a modulus of elasticity of 1 to 100 MPa (25 DEG C) after dry curing. Preferably, the resin paste has a solid content of 40 to 90% by weight, a thixotropy index of 1.5 to 8.0, and a viscosity (25 DEG C) of 5 to 1000 Pa.s. A semiconductor device is produced using the resin paste by a method comprising (1) coating a predetermined amount of the resin paste onto a substrate, (2) drying the resin paste to bring the resin to B-stage, (3) mounting a semiconductor chip onto the B-stage resin, and (4) post-curing the resin.

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