A semiconductor device for preventing mechanical and heat damage for semiconductor chip and its manufacture method. Laser beam welds a first connection welding disc formed on a first outer lead to a first electrode formed on the semiconductor chip. A first connection forms in the first connection welding disc, and be superposed with the first connection electrode. Laser beam irradiates area containing connection hole, the first connection welding disc around the first connection hole fuses to form fusion part and welds to the first connection electrode, so semiconductor device with excellent electrical property forms.