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发明公开
CN101341628A 芯片元件 无效 - 撤回

芯片元件
摘要：
芯片元件(100)，层叠了电介质基板(1)，在电介质基板(1)的上主面设置的第1绝缘层(2)和覆盖第1绝缘层(2)整体的第2绝缘层(3)。并在电介质基板(1)和第1绝缘层(2)之间设置了含有共振线路的电路图案(12)。在第1绝缘层(2)上，在与电路图案(12)的边界以内一侧相对的位置处，沿电路图案(12)的延伸方向排列着不含有导电体的多个孔(H)。
摘要（英）：

A chip component (100) is obtained by laminating a dielectric substrate (1), a first insulating layer (2) provided on a principal surface of the dielectric substrate (1), and a second insulating layer (3) covering substantially the entire first insulating layer (2). A circuit pattern (12) includes a resonance line provided in an interface between the dielectric substrate (1) and the first insulating layer (2). A plurality of through holes (H) is aligned on the first insulating layer (2) along an extending direction of the circuit pattern (12) at locations facing an area within the boundary of the circuit pattern (12).

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