The invention provides prepreg and laminate for a printed wiring board, having high flame retardancy without the use of a halogen compound or a phosphorus compound as a flame retardant and small thermal expansion coefficient. The prepreg for a printed wiring board, comprises a cyanate ester resin having a specific structure, a non-halogen epoxy resin, a silicone rubber powder as a rubber elasticity powder, an inorganic filler and a base material, which prepreg retains heat resistance owing to a stiff resin skeleton structure, has high-degree flame retardancy without the use of a halogen compound or a phosphorus compound as a flame retardant, and has a small thermal expansion coefficient in plane direction without using a large amount of inorganic filler.