The invention discloses a test structure of a sinking phenomenon in the metal manufacture procedure process, wherein metals to be tested are arranged in sequence. The structure comprises a first test chip which extends to form a first test wire including a plurality of branches, a second test chip which extends to form a second test wire including a plurality of branches, and a third test chip connected to the second test wire. A voltage is applied between the first test chip and the second test chip. Whether the sinking phenomenon causing bridging exists or not is tested according the ampereof the measured current. A voltage is applied between the second test chip and the third test chip. Whether the sinking phenomenon causing bridging exists or not is tested according the ampere of thecurrent. Through the adoption of the technical proposal of the invention, whether the metal sinking phenomenon exists in the metal layer or not, and whether the serious metal sinking phenomenon causing bridging exists or not can be conveniently tested, thereby conducting the correction in time and avoiding the damage to a device caused by the sinking phenomenon.