The invention relates to a solar cell marking method, having the following steps: provision of a substrate having a substrate surface for producing a solar cell (1) which has an active zone (5), and production of at least one depression (21, 31) in the substrate surface using laser radiation, the at least one depression (21, 31) forming a marker (2, 3) for marking the solar cell (1), and the depression (21, 31) being produced before a solar cell production process is carried out or while a solar cell production process is being carried out. In line with the invention, the substrate is in the form of a semiconductor wafer having a wafer surface, and the marker (2, 3) is positioned on the wafer surface such that the marker (2, 3) is in the active zone (5) of the solar cell (1) formed from the semiconductor wafer. The invention also relates to a semiconductor wafer solar cell (1) whose marker is easily identifiable and hence is positioned so as to be reliably readable without this adversely affecting the operability of the solar cell (1).