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发明授权
CN101400716B 热固性树脂组合物、挠性电路基板用外覆剂和表面保护膜 失效 - 权利终止

热固性树脂组合物、挠性电路基板用外覆剂和表面保护膜
摘要：
本发明提供了可以得到与基材的密合性，特别是与锡的密合性优异，且电绝缘的长期可靠性优异，翘起小的保护膜的外覆剂和热固性树脂组合物。本发明的热固性树脂组合物特征在于，以含有羧基的聚氨酯树脂(A)、固化剂(B)、和酸酐(C)为必须成分。另外，本发明的挠性电路基板用外覆剂的特征在于，含有上述构成的热固性树脂组合物。本发明的表面保护膜的特征在于，由上述的热固性树脂组合物的固化物形成。
摘要（英）：

This invention provides an overcoating agent, which has excellent adhesion to a base material, particularly to tin, and, at the same time, has excellent long-term reliability of electrical insulation, and can provide a protective film having a small warpage level, and a heat curable resin composition. The heat curable resin composition is characterized by comprising a carboxyl group-containing urethane resin (A), a curing agent (B), and an acid anhydride (C) as indispensable components. The overcoating agent for a flexible circuit board is characterized by comprising a heat curable resin composition having the above constitution. There is also provided a surface protective film characterized by comprising a cured product of the heat curable resin composition.

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