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发明授权
CN101402514B 氧化物接合用焊料合金和使用了它的氧化物接合体 失效 - 权利终止

氧化物接合用焊料合金和使用了它的氧化物接合体
摘要：
本发明提供一种对于氧化物的接合能够达成优异的接合强度和气密封接性的、低熔点的氧化物接合用焊料合金以及使用了它的氧化物接合体。本发明是以质量％计，含有Mg为1.0％以下(不含0％)，作为实质上由Bi和Sn构成的氧化物接合用焊料合金，优选的组成为，Mg：0.01～0.6％，Bi：35～86％，余量实质上是Sn。本发明能够用于玻璃之间等这种氧化物的接合，能够得到廉价的氧化物接合体。
摘要（英）：

The invention provides a solder alloy having a low melting point and excellent bonding strength and airtight sealing properties, and a solder joint of an oxide material bonded using the solder alloy. The solder alloy for bonding an oxide material according to the invention has a low melting point so that can be obtained. The solder alloy for bonding an oxide material, includes more than 0% but not more than 1.0% of Mg and the balance being substantially Bi and Sn. Preferably, the alloy includes 0.01 to 0.6% of Mg, 35 to 86% of Bi, and the balance being substantially Sn. The invention can be used for bonding an oxide material, such as bonding glasses to each other. According to the invention, a low-cost solder joint of an oxide material is also provided.

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