The object of the present invention is to provide a film vapor deposition apparatus which does not require an ITO coating and the like single membrane or about 3 to 5 layers of thin-film system to regularly remove particles in a central chamber of the object, so as to manufacture a loading locking chamber capable of very easily using a multi-layer substrate fixer structure, after coating a good deal of substrates. The apparatus includes: a multi-layer substrates fixer mounting room (MSSHR), installed with a plurality of substrates for vapor deposition of vacuum films; a multi-layer substratesfixer (MSSH), composed of a plurality of substrate fixers respectively fixing these substrates installed from the MSSHR, wherein, a first projecting section and a second projecting section are respectively formed at a certain position at one side of the MSSH; a first linear transfer drive section (MUMG); a second linear transfer drive section (MUML); a vapor deposition transfer drive section; anda film vapor deposition chamber (CMS).