The invention discloses an LED chip packaging structure and a packaging method. The packaging structure comprises two lead-frames, an LED chip and a packaging housing, and also a plurality of wires connecting an electrical connector, the LED chip and the lead-frames, as well as a closed layer are further included; wherein, the packaging housing is provided with an internally concave reflection area, and the closed-layer is filled in the internally concave reflection area. The packaging structure is characterized by the packaging of the lead-frames, namely, a first connecting part is peripherally arranged on the lead-frame, and a second connecting part which is matched with the first connecting part is arranged on the position at which the packaging housing and the lead-frames are combined. The first connecting part or the second connecting part is provided with a convexo-concave surface consisting of protruding ribs and grooves, and the matching of the grooves and the protruding ribs can tightly combine the closed layer and the lead-frames. The design of the packaging structure can reduce the thickness of the lead-frames, and increase the combination area between a rubber base andthe lead-frames, so that the packaging plastic is not easy to shed.