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发明授权
CN101436631B 封装发光二极管的方法 失效 - 权利终止

封装发光二极管的方法
摘要：
一种封装发光二极管的方法，包括提供一物料，将物料进行干燥处理后加入一进料口，再提供预先埋藏一发光二极管的一模具，物料由进料口进入，并通过一螺杆将物料加压射出至模具中，使该物料与该发光二极管结合。
摘要（英）：

The invention relates to a method for packaging a light-emitting diode. The method comprises the following steps: providing a material; drying the material and adding the material into a feed opening; providing a mould for pre-embedded with the light-emitting diode; and pressurizing the material through a screw rod and shooting out the material to the mould after the material enters from the feedopening so that the material is combined with the light-emitting diode.

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