The present invention provides a lighting device package with one or more light-emitting elements operatively coupled to a substrate and a frame disposed at least in part around one or more light-emitting elements. The frame and substrate define a cavity in which the one or more light-emitting elements are positioned, wherein the cavity can be substantially enclosed by an optically transmissive system. At least a portion of the cavity can be filled with an encapsulation material. The frame and the top surface of the substrate define one or more passageways, wherein each passageway interconnects the cavity with the outside through an outside port. For example, the outside port can be accessible from the ambient when the lighting device package is in an assembled state, thereby enabling fluidic movement of the encapsulation material into and/or out of the cavity. The invention also relates to a method for manufacturing the lighting device package.