利索-全球专利检索

  1. 登录
  2. 注册
发明授权
CN101516941B 非热熔性粒状酚醛树脂及其制造方法以及热固性树脂组合物、半导体用密封材料及半导体用胶粘剂 有权

非热熔性粒状酚醛树脂及其制造方法以及热固性树脂组合物、半导体用密封材料及半导体用胶粘剂
摘要：
本发明提供一种平均粒径为20μm以下、单粒率为0.7以上、优选氯含量为500ppm以下的非热熔性粒状酚醛树脂。该本发明的非热熔性粒状酚醛树脂可以用作半导体用密封材料及半导体用胶粘剂等有机填料或者用作分子筛碳、炭精电极材料等功能性碳材料的前体等。
摘要（英）：

Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 [mu]m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

公开/授权文献
0/0