Provided is an electronic device package which can easily cope with diversification of electronic component configuration and is not harmful to the environment in the aspects of the number of manufacturing steps and resource consumption. A package structure in one working example is provided with a substrate (1), a wiring (2) formed on the surface of the substrate (1), an electrode pad (3), an electronic component (5), and a bonding material (4) for bonding the external electrode (6) and an external electrode (6) of the external component (5). The wiring (2), the electrode pad (3) and the bonding material (4) are all composed of the same material, and furthermore, the electrode pad (3) operates also as the bonding material (4).