The present invention relates to Sn-Ag-Cu lead-free solder containing Nd, Ni and Co, belonging to metal materials and brazing materials in the metallurgical field. The solder comprises the following chemical components by weight percent: 3.5 to 4.5 percent of Ag, 0.2 to 1.5 percent of Cu, 0.16 to 0.5 percent of Nd, 0.025 to 0.1 percent of Ni, 0.001 to 0.1 percent of Co, 0.05 to 0.1 percent of Pb, and the balance Sn. Tin slabs, sycees, electrolytic copper, metal Nd, metal Ni, and metal Co which are sold on market are proportioned as required, optimally screened covering agent is added during smelting or inset gas is adopted for protection to carry out the smelting and casting, and bar materials are obtained. Wire materials are obtained by extrusion and drawing or flux-cored wires can be obtained by adding flux. The solder can be manufactured into granules by a powder manufacturing apparatus (the size of the granule can be 0.106 mm (140 meshes) to 0.038mm (400 meshes)).