The invention relates to a semiconductor luminous element, which comprises a shell, a heat conductor, a semiconductor chip, a packaging colloid and a fluorescent layer. The shell is provided with a base wall and a peripheral wall which protrudes upwards from the upper surface periphery of the base wall, the base wall center forms a punch hole, the base wall and the peripheral wall define a groovetogether, and the wall surface around the groove is a diffusing surface. The heat conductor is arranged on the lower surface side of the base wall, and partial area of the heat conductor is positioned on the bottom side of the punch hole to make the punch hole form an inner groove. The semiconductor chip is arranged on the heat conductor and positioned in the inner groove. The packaging colloid is covered on the semiconductor chip and fills the inner groove and the groove. The fluorescent layer is covered on the surface of the packaging colloid.