Disclosed is a resin material adhesion method for adhering a resin material (X) comprising an oxymethylene polymer (A) to a resin material (Y). In the method, the resin material (Y) is an oxymethylene polymer composition (B) which satisfies the following requirements (1) and (2) or, alternatively, the resin material (Y) is the same as the resin material (X) or other type of resin material and the oxymethylene polymer composition (B) is arranged between the resin material (Y) and the resin material (X). The resin materials are subjected to a heat treatment. Also disclosed is a structure produced by the adhesion method. (1) The oxymethylene polymer composition (B) has a melting point lower than that of the oxymethylene polymer (A), and the difference between the melting points of the oxymethylene polymer composition (B) and the oxymethylene polymer (A) is less than 5 DEG C. (2) 50% or more of the peak area as determined from a peak showing the melting state of the oxymethylene polymer composition (B) determined by DSC appears in a temperature area lower by 5 DEG C or more than the peak temperature of the oxymethylene polymer (A).