A tuner device lightens a mechanical stress that changes along with the temperatures of a grounding terminal, a circuit substrate and a lead-free solder; it is able to prevent the lead-free solder from having crack even if using the lead-free solder. A sequential transfer punching is carried out on a bending portion (110a), that is one portion of the grounding terminal (105A) that extends from one part of a tuner shell (101) to form a width that is narrower than the grounding terminal in the vicinity of a solder jointing portion (108); or a shaping processing step is carried out to form a plate thickness thinner than the grounding terminal plate in the vicinity of the solder jointing portion (108). Therefore, the stress caused by the thermal expansion coeffici9ent difference of the grounding terminal (105A), the circuit substrate (102) and the lead-free solder when driving the tuner device can be absorbed by the bending portion (110A) and the occurrence of crack on the lead-free solder can be prevented.