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发明授权
CN101636112B 超声波探头及其制造方法及超声波诊断装置 有权 转让

超声波探头及其制造方法及超声波诊断装置
摘要：
本发明的超声波探头为如下所述的超声波探头(2)，其具备：具有与偏置电压对应改变机电耦合系数或灵敏度的多个振动要件，且发送接收超声波的cMUT芯片(20)；设置于所述cMUT芯片(20)的超声波辐射侧的音响透镜(26)；设置于所述cMUT芯片(20)的背面侧，且吸收所述超声波的传播的背衬层(22)；从所述cMUT芯片(20)的周缘部开始设置于所述背衬层(22)的侧面，且配置有与所述cMUT芯片(20)的电极连接的信号图案的电配线部(挠性基板(72))；收容所述cMUT芯片(20)、所述音响透镜(26)、所述背衬层(22)及所述电配线部(挠性基板(72))的框体部(超声波探头罩(25))，在所述cMUT芯片(20)的超声波辐射侧设置有接地电位的接地层(导电膜(76))。
摘要（英）：

An ultrasonic probe (2) comprises a cMUT chip (20), which has a plurality of vibration elements whose electromechanical coupling coefficient or the sensitivity changes depending on a bias voltage, and transmits/receives an ultrasonic wave; an acoustic lens (26) provided on the ultrasonic wave radiation side of the cMUT chip (20); a backing layer (22) provided on the back side of the cMUT chip (20) for absorbing propagation of the ultrasonic wave; an electric wiring portion (flexible substrate (72)), which is provided from the peripheral portion of the cMUT chip (20) to the side face of the backing layer (22) and has a signal pattern connected with the electrode of the cMUT chip (20) arranged thereon; and a housing (ultrasonic probe cover (25)) for containing the cMUT chip (20), the acoustic lens (26), the backing layer (22) and the electric wiring portion (flexible substrate (72)). A ground layer (conductive film (76)) of ground potential is provided on the ultrasonic wave radiation side of the cMUT chip (20).

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