An electrical structure and method of forming. The electrical structure includes a first substrate comprising a first- electrically conductive pad, a second substrate comprising a second electricallyconductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect. structure comprises a non-solder metallic core structure with a cylindrical or spherical shape, a first solder structure, and a second solder structure.. The first solder structure electrically and mechanically connects a first portion of the non- solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non- solder metallic core structure to the second electrically conductive pad.