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发明公开
CN101661925A 芯片封装 无效 - 撤回

芯片封装
摘要：
本发明提出一种芯片封装，包括一线路基板、一第一芯片、多条第一焊线、一元件、一第一粘着层以及一封装胶体。第一芯片具有一第一有源面、一第一背面及多个第一焊垫，第一背面粘附于线路基板上，且第一芯片电性连接至线路基板。第一焊线电性连接至线路基板与第一芯片的第一焊垫。元件配置于第一芯片的第一有源面的上方。第一粘着层粘附于第一有源面与元件之间，且未覆盖第一焊垫。第一粘着层包括一粘附于第一芯片的部份第一有源面的第一B阶粘着层以及一粘附于第一B阶粘着层与元件之间的第二B阶粘着层。
摘要（英）：

A chip package including a circuit substrate, a first chip, a plurality of first bonding wires, an element, a first adhesive layer and a package colloidal is provided. The first chip has a first active surface, a first rear surface and a plurality of first bonding pads, the first rear surface is adhered on a circuit substrate, and the first chip is electrically connected with the circuit substrate. The first bonding wires are electrically connected with the circuit substrate and the first bonding pads of the first chip. The element is disposed over the first active surface of the chip. The first adhesive layer is adhered between the first rear surface and the element and is not covered on the first bonding pads. The first adhesive layer includes a first B-staged adhesive layer adhered on the first rear surface and the element and a second B-staged adhesive layer adhered between the first B-staged adhesive layer and the element.

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