The invention relates to a packaging structure for a miniature electric field sensor, which is capable of realizing static accumulation resistance, eliminating effects of self electrification and the like, and improving the reliability and stability of actual detection. The packaging structure for the miniature electric field sensor mainly comprises two same detection units and a packaging supporting structure, wherein each detection unit mainly comprises a substrate, a conductor cover, a sensor chip and the like, the sensor is arranged on the substrates respectively, and performs metal deposition and cablings to prepare a detection circuit of the sensor so as to realize close combination of the substrates and the conductive covers through the simple and efficient sealing technology. The detection units realize symmetric arrangement of the structure through the flip chip technology, and fix and mount the whole packaging structure by using the supporting structures packaged by the sensor. The packaging structure can realize system-in-package of the miniature electric field sensor.