The invention relates to a light-sensitive resin composite and a method for manufacturing a printed circuit board using the same. The resin composition comprises the following components: (A) an adhesive polymer, (B) a light polymeric compound with an ethylene unsaturated bond and (C1) a stilbazole compound represented by the following general formula (1); in the formula (1), R1, R2 and R3 respectively represent alkyl with the carbon number of 1-20, alkoxyl with the carbon number of 1-6, alkyl ester with the carbon number of 1-6, amido, and alkyl amido, carboxyl, cyanogen group, nitryl or (methyl) acryloyl group with the carbon number of 1-20 independently, m and n respectively represent the integer of 1-3 independently, and a, b and c respectively represent the integer of 0-5 independently.