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发明授权
CN101771024B 发光二极管及其封装方法 有权

发光二极管及其封装方法
摘要：
本发明公开了一种发光二极管及其封装方法，其中，发光二极管包括电路板，所述电路板上直接焊接有多个以一定阵列排布的发光二极管LED芯片，该LED芯片上浇注有透明封装体，该透明封装体中含有扩散颗粒和/或荧光粉，所述电路板的端面上设置有正电极与负电极。其中多个LED芯片以一行多列排布，所述LED为线光源；或者，多个LED芯片以多行多列排布，所述LED为面光源。本发明实施例只需要对LED芯片进行一次封装便可形成应用于照明和显示领域的LED面光源或线光源，大大简化了LED的生产工艺，并节省了不必要的LED生产工艺中所需的生产原料，降低了LED的生产成本。
摘要（英）：

The invention discloses a light-emitting diode (LED) and a packaging method thereof. The LED comprises a circuit board, wherein a plurality of LED chips which are distributed in a certain array are directly welded on the circuit board; a transparent packaging body is poured on the LED chips and contains diffuse particles and/or fluorescent powder; a positive electrode and a negative electrode arearranged on the end surface of the circuit board; the LED chips are distributed in one line and multiple rows, and the LED is a line light source; or the LED chips are distributed in multiple lines and rows, and the LED is a surface light source. The embodiment of the invention can form the LED surface light source or line light source which is applied to the fields of illumination and display just by packaging the LED chips once, greatly simplifies the production process of the LED, saves production raw materials needed in an unnecessary LED production process and reduces the production costof the LED.

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