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发明公开
CN101771058A 背面照明图像传感器及其制造方法 无效 - 撤回

背面照明图像传感器及其制造方法
摘要：
本发明涉及背面照明图像传感器及其制造方法。其中，根据实施例的背面照明图像传感器包括：位于第一衬底的正面上的器件隔离区和像素区；位于像素区上的光传感器和读出电路；位于第一衬底的正面上的层间电介质层和金属线；键合到其上形成有金属线的第一衬底的正面的第二衬底；位于第一衬底的背面的器件隔离区上的像素隔离电介质层；以及位于第一衬底的背面的光传感器上的微透镜。
摘要（英）：

The invention relates to a back side illumination image sensor and method for manufacturing the same. The back side illumination image sensor according to an embodiment includes: a device isolation region and a pixel region that are on a front side of a first substrate; a light sensor and a readout circuit that are on the pixel region; an interlayer dielectric layer and a metal line that are on the front side of the first substrate; a second substrate that is bonded to the front side of the first substrate on which the metal line is formed; a pixel isolating dielectric layer that is on the device isolation region at a back side of the first substrate; and a microlens that is on the light sensor at the back side of the first substrate.

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