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发明授权
CN101775264B LED固晶胶 失效 - 权利终止

LED固晶胶
摘要：
本发明公开了一种LED固晶胶，是由以下组分配制而成，各组分含量(总重量按100％计)为：OE-6630A(硅胶主剂)4.10％-4.60％；OE-6630B(硅胶固化剂)6.30％-6.80％；三氧化二铝粉剂(Al2O3)3.20％-3.80％；二氧化硅粉剂(SiO2)0.85％-0.95％；SCR1012A(硅胶主剂)3.50％-3.90％；SCR1012B-R(硅胶固化剂25.10％-28.10％；PA-1〔片状银粉〕43.10％-47.55％；SA-1(颗粒状银粉)6.40％-7.25％；聚酰胺固化剂1.7％-2.0％；环己酮0.19％-0.22％。本发明具有定位精度稳高，耐高温高热，高导热性，高透光性，高折射性，信赖度优良，且使用便捷、价格低廉的优点，可广泛用于SMD、PLCC、LAMP、DISPLAY等LED元件之芯片(CHIP)的粘接。
摘要（英）：

The invention discloses a chip fixing glue for LEDs (Light Emitting Diodes), which is prepared form the following components by percentage content (total weight of 100percent): 4.10% -4.60%of OE-6630A (silicone main agent); 6.30% -6.80% of OE-6630B (silicone curing agent); 3.20% -3.80% of aluminum oxide powder (Al2O3); 0.85% -0.95% of silica powder (SiO2); 3.50% -3.90% of SCR1012A (silicone main agent); 25.10%-28.10% of SCR1012B-R (silicone curing agent); 43.10% -47.55% of PA-1(flake silver powder); 6.40% -7.25% of SA-1 (granular silver powder); 1.7% -2.0% of polyamide curing agent; and 0.19%-0.22% of cyclohexanone. The invention has the advantages of high positioning accuracy, high-temperature and high heat resistance, high heat conductivity, high light transmission, high refrangibility, favorable confidence degree, convenient and quick use and low price and can be widely used for the bonding of chips of LED components, such as SMD (surface mount device), PLCC (plastic leaded chip carrier), LAMP, and DISPLAY and the like.

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