The invention relates to a multi-impingement-surface for cooling a wall, capable of planedly and conductively contacting with the surface of a wall to be cooled and comprising a plurality of pore plate surfaces and a plurality of splicing surfaces. The pore plate surfaces comprises a plurality of straight through holes as the pore plate constructions distributed on the surface of the pore plate surfaces and the splicing surfaces and the pore plate surfaces are alternatively stacked and the slicing plates are distributed on the surface of the pore plate layer and correspondingly spliced with the pore plate layer, wherein each splice of one splicing layer is respectively aligned with one of the splice of other splicing layers and each straight through hole of one pore plate layer is staggered relative to the other straight through hole of the adjacent pore plate layer, therefore the multi-impingement-surface is loaded by the pressure using a cooling fluid at a flat side and the cooling fluid flows through the straight through hole and the middle clearance between the splice and the pore plate layer and thus the heat flow from the wall is discharged along with the cold flow.