The invention relates to a mechanism for taking out boxed silicon wafers. A third servo motor is fixed on a rack through a connecting rod; a lead screw is connected with a coupler and the third servo motor; a linear guide rail is fixed on a supporting seat; an elevating platform is fixed on the linear guide rail and the lead screw; a first servo motor is fixed on the elevating platform; a spindleis installed on the elevating platform; a first synchronous pulley is installed on the shaft of the first servo motor, and a second synchronous pulley is installed on the spindle; a synchronous belt is connected on the first synchronous pulley and the second synchronous pulley; one end of a transmission shaft is provided with the synchronous pulley; the other end of the transmission shaft is provided with a driving wheel; and a second conveyer belt is installed on the driving wheel and a roller. The invention can placidly take out the silicon wafers in a box one by one without damaging the silicon wafers and greatly improves the silicon wafer taking efficiency; the stability of the mechanism is much higher than manual operation, the mechanismeffectively ensures the silicon wafer transportation accuracy, lowers man power and cost and effectively ensures the silicon wafer quality during the moving process.