A printed wiring board with through-holes having an insulating resin substratum provided with through-holes whose interior is filled with plating, wherein the positions of center-of-gravity axes of respective through-holes exposed from the front surface and rear surface of the insulating resin substratum are arranged so as to be shifted from each other. Thus, there is provided a printed wiring board with through-hole structure that realizes reducing of defects, such as void, and cracking, reducing of board connection failure and increasing of the mechanical strength of the board.