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发明授权
CN101794768B 发光二极管封装体及投影装置 失效 - 权利终止

发光二极管封装体及投影装置
摘要：
一种发光二极管封装体，包括一承载器、至少一发光二极管芯片及一导光元件。发光二极管芯片配置在承载器上。导光元件配置在承载器上，并位于发光二极管芯片上方。导光元件包括一透光本体、一光积分部、一反射膜及一支撑部。光积分部连接至透光本体，并位于透光本体与发光二极管芯片之间。光积分部具有一入光面及至少一侧面。入光面面向发光二极管芯片。侧面连接透光本体与入光面。反射膜配置在侧面上。支撑部连接至透光本体，并环绕光积分部。支撑部承靠承载器，且透光本体、光积分部及支撑部为一体成型。一种投影装置亦被提出。
摘要（英）：

The invention relates to a light emitting diode package which comprises a loader, at least one light emitting diode chip and a light guide element, wherein the light emitting diode chip is arranged on the loader; the light guide element is also arranged on the loader above the light emitting diode chip and comprises a transparent body, a light integration part, a reflecting film and a supporting part; the light integration part is connected to the transparent body between the transparent body and the light emitting diode chip and provided with a light inlet surface and at least one side surface; the light inlet surface faces towards the light emitting diode chip, and the side surfaces are connected with the transparent body and the light inlet surface; the reflecting film is arranged on the side surfaces; the supporting part is connected to the transparent body and surrounds the light integration part; the supporting part supports and leans against the loader; and the transparent body, the light integration part and the supporting part are integrally molded. The invention also provides a projecting device.

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