A light emitting device package and a method for manufacturing the same are provided. The light emitting device package comprises a package body including a cavity disposed at an upper portion. The light emitting device package includes an insulating layer disposed on a surface of the package body, wherein the insulating layer is expanded to part of a rear surface of the package body and a side surface of the package body. The light emitting device package includes a plurality of metal layers disposed on the insulating layer. The light emitting device package includes a light emitting device disposed in the cavity. The light emitting device package includes a first metal plate disposed at the rear surface of the package body at a location corresponding to the light emitting device. The insulating layer is disposed at a first open area which is opened on the bottom of the cavity; and the insulating layer is disposed at a second open area which is opened on the bottom of the cavity, wherein the light emitting device is arranged in the first open area, the light emitting device is electrically connected to the plurality of metal layers on the insulating layer, and the first metal plate is arranged in the second open area.