The invention relates to a semiconductor sealing structure comprising a chip, a lead frame, unsealed annular adhesive, a radiating fin and an adhesive body, wherein the lead frame comprises a core supporting seat which comprises an upper surface and a lower surface, the core supporting seat is used for supporting the chip and comprises at least one through hole corresponding to the chip, the unsealed annular adhesive is used for fixing the chip on the upper surface of the chip supporting seat, the chip is blocked up, and therefore, a scheduled space and at least one opening are arranged between the chip and the chip supporting seat; the radiating fin is bonded on the lower surface of the chip supporting chip and comprises at least one concave part corresponding to the through hole, the adhesive body is used for coating a part of the lead frame, the chip and the radiating fin, is filled into the space and the opening between the chip and the chip supporting seat, the through hole of the chip supporting seat and the concave part of the radiating fin to form at least one model lock, and the model lock is positioned among the chip, the chip supporting seat and the radiating fin.