The invention relates to a method for manufacturing a flexible carrying board of which the chip is directly packaged on a flexible printed circuit carrying board (COF), in particular to a method for manufacturing a golden finger of a soldering-pan of a flexible carrying board. The COF packaged flexible carrying board is made of a glueless flexible substrate; a basement membrane of the substrate is made of a polyimide material and has the thickness between 12 and 25 micrometers; and a conductor layer is made of copper, and has the thickness between 9 and 36 micrometers. The method for manufacturing the golden finger of the soldering-pan of the flexible carrying board comprises low-stress electroless nickel plating & gold immersion technology; a raw material is nickel sulfate and a reducing agent is sodium hypophosphite; and in order to reduce the stress of a nickel layer, an additive for reducing the stress is added. The low-stress additive is one or more of benzene sulfonic acid sodium salt, coumarin, formaldehyde, aldehyde and naphthalene disulfonic acid, and the concentration is 0.01 to 0.2 mol/l. The operating temperature of the low-stress electroless nickel plating is between 80 and 85 DEG C and the pH value is between 4.8 and 5.2.