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发明公开
CN101861228A 激光加工装置以及激光加工方法 有权

激光加工装置以及激光加工方法
摘要：
本发明涉及一种激光加工装置(1)，其具备激光光源(10)、空间光调制器(20)、控制部(22)、聚光光学系统(30)以及遮挡部件(40)。相位调制型的空间光调制器(20)输入从激光光源(10)输出的激光，呈现用于在二维排列的多个像素的每一个上调制激光的相位的全息图，并输出该相位调制后的激光。控制部(22)依次在空间光调制器(20)中呈现多个全息图，利用聚光光学系统(30)使从空间光调制器(20)输出的激光聚光于一定个数M个的聚光位置，并选择性地将该M个聚光位置中的N个聚光位置配置于加工区域(91)，从而对加工对象物(90)进行加工。
摘要（英）：

A laser machining device (1) comprises a laser light source (10), a spatial light modulator (20), a controller (22), a light collection optical system (30), and a shielding member (40). The phase-modulation spatial light modulator (20) receives laser light outputted from the laser light source (10), gives a hologram for phase-modulating the laser light at each of two-dimensionally arranged pixels, and outputs the phase-modulated laser light. The controller (22) causes the spatial light modulator (20) to sequentially give holograms, collects the laser light outputted from the spatial light modulator (20) at M (that is a fixed number) light collection positions by the light collection optical system (30), and selectively disposes N light collection positions out of the M light collection positions in a machining region (91) to machine an object to be machined (90).

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