The invention relates to a packaging method of an organic luminous semiconductor device, which comprises the following steps of: firstly, coating an organic photosemiconductor compound layer and an absorption layer on the same side of a substrate layer; secondly, adhering a protective layer to the substrate layer to form a first sealing space and aging the first sealing space by the absorption layer to absorb interfering substances such as water vapor, oxygen and the like in the first sealing space; and thirdly, carrying out pressure sealing to the first sealing space to divide the first sealing space into a sealing space which contains the organic photosemiconductor compound layer and a sealing space which contains the absorption layer; and finally, separating the sealing space containing the organic photosemiconductor compound layer from the sealing space containing the absorption layer to complete the package of the organic luminous semiconductor device. The packaging method finally separates the absorption layer out, thereby improving the work performance of the packaged organic luminous semiconductor device, and increasing the light transmission property and the flexibility of the packaged organic luminous semiconductor device at the same time.