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发明授权
CN101931044B 热电模块和相关方法 有权

热电模块和相关方法
摘要：
本发明涉及热电模块和相关方法。用于制造热电模块的示例方法包括：将第一晶片和第二晶片联接在一起；加工第一和第二晶片，以形成第一热电元件和第二热电元件，其中第一热电元件和所述第二热电元件联接在一起；将第一热电元件联接到第一导体；将第二热电元件联接到第二导体；分离第一热电元件和第二热元件；将第一热电元件联接到第三导体，由此第一热电元件、第一导体以及第三导体形成热电模块的至少一部分；并且将第二热电元件联接到第四导体，由此第二热电元件、第二导体以及第四导体形成另一个热电模块的至少一部分。
摘要（英）：

The present invention relates to thermoelectric modules and related methods. An example method for making thermoelectric modules generally includes coupling a first wafer and a second wafer together, processing the first and second wafers to produce a first thermoelectric element and a second thermoelectric element where the first thermoelectric element and the second thermoelectric element are coupled together, coupling the first thermoelectric element to a first conductor, coupling the second thermoelectric element to a second conductor, separating the first thermoelectric element and the second thermoelectric element, coupling the first thermoelectric element to a third conductor whereby the first thermoelectric element, the first conductor, and the third conductor form at least part of a thermoelectric module, and coupling the second thermoelectric element to a fourth conductor whereby the second thermoelectric element, the second conductor, and the fourth conductor form at least part of another thermoelectric module.

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