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发明公开
CN101949013A 含铜材料用蚀刻剂组合物及含铜材料的蚀刻方法 无效 - 驳回 复审申请

含铜材料用蚀刻剂组合物及含铜材料的蚀刻方法
摘要：
本发明提供一种含铜材料用蚀刻剂组合物及含铜材料的蚀刻方法，可以形成没有形状不良的微细图案。本发明的含铜材料用蚀刻剂组合物由水溶液构成，该水溶液含有：(A)0.1～15质量％的从铜离子和铁离子中选择的至少一种氧化剂成分；(B)0.1～20质量％的氯化氢；以及(C)0.001～5质量％的用下述通式(1)表示，并且数均分子量为500～1,500的非离子型表面活性剂，在所述通式(1)中，R表示碳原子数为8～18的烷基，X表示环氧乙烷单元与环氧丙烷单元无规聚合或嵌段聚合的聚环氧烷基。R-O-X-H (1)
摘要（英）：

The invention provides an etchant composition for materials containing copper capable of forming micro circuit patterns without bad shapes and an etching method of materials containing copper. The etchant composition for materials containing copper is composed of aqueous solution which comprises (A) at least one 0.1-15% by mass oxidant component selected from copper ion and iron ion, (B) 0.1-20% by mass hydrogen chloride, and (C) 0.001-5% by mass non-ionic surfactant which is shown in the following formula (1) and has 1,500-3,000 number-average molar mass. In the formula (1), R represents alkyl having 8-18 carbon atoms; X represents polypropylene alkyl which is formed by the irregular polymerization or block polymerization of ethylene oxide unit and propylene epoxide. The formula (1) is R-O-X-H.

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