The invention relates to a first-coating last-etching single package method for positively packaging a double-sided graphic chip. The method comprises the following technical steps: taking a metal substrate; plating a metal layer to coat the metal substrate; carrying out backside etching on the metal substrate; enveloping plastic pacing material (epoxy resin) without filler on the backside of themetal substrate; carrying out positive etching on the metal substrate; etching the positive sides of a basic island and a pin, wherein the backside sizes of the basic island and the pin are smaller than the positive sizes of the basic island and the pin to form a basic inland and pin structure with big top and small bottom; loading pieces; routing metal wires; enveloping local units by using plastic pacing material (epoxy resin) with filler on the positive side of the semi-finished product to ensure local unit areas on the positive side of the pin to expose the plastic pacing material (epoxy resin) with filler; plating metal layers on the backsides of the island and the pin and the positive side of the pin for coating; and cutting. The package structure of the chip prepared by the method of the invention does not have the problem of falling feet, and the length of the metal wires is shortened.